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HMC6343
PACKAGE OUTLINES
PACKAGE DRAWING HMC6343 (32-PIN LPCC, dimensions in millimeters)
E1
D1
e
0.10±0.08
0.34±0.03
D
0.57±0.03
Pin 1
E
Bottom View
Dimensions (mm)
A (height)
D
D1
E
E1
e
Minimum
1.73
-
-
-
-
-
Nominal
1.87
9.00 BSC
6.40 BSC
9.00 BSC
6.40 BSC
0.8 Basic
Maximum
2.02
-
-
-
-
-
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC6343. All dimensions are nominal and in
millimeters.
Stencil Design and Solder Paste
A 4-6 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC6343 has been
assembled successfully with no-clean solder paste.
.
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